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1、Excellent dust removal effect, with anti-static function.
2、Highly efficient water absorption
3、Soft and will not damage the surface of the object.
4、Provide sufficient dry and wet strength.
5、Low ion release; 6、It is not easy to cause chemical reaction.
6、It is not easy to cause chemical reaction.
7、Optional sealing: ultrasonic, laser, cold cutting. Scope of application: semiconductor assembly, aviation manufacturing and maintenance, laboratories, electronics industry, computer assembly, optical instrument manufacturing, LCD liquid crystal display, precision instruments, optical products, aviation industry, and circuit board production lines, etc.; especially for the semiconductor industry, electronics industry production of 10-10,000 purification plant.
8、Using 18MΩ ultra-pure CDI cleaning, in the most advanced 100-class clean room packaging; four sides of the use of laser sealing, hair, fiber reduction, low dust fall, ion release is low
9、Excellent dust removal effect, with anti-static function; efficient water absorption, soft and will not damage the surface of the object; provide sufficient dry and wet strength.
10、Low ion release; not easy to cause chemical reaction. Optional sealing: ultrasonic, cold cutting.
11、Dust-free cloth the edges of the product is sealed by the most advanced edge cutting machine, wipe
It will not leave particles and threads, and has a strong ability to remove dirt.
12、Can use two sides of the fused edge sealing, the other two sides of the heat sealing method, or four sides of the fused edge sealing, can provide better protection of the edge.
13、Excellent dust removal effect, with anti-static function, efficient water absorption, soft will not damage the surface of the object.
Translated with www.DeepL.com/Translator (free version)
1、Excellent dust removal effect, with anti-static function.
2、Highly efficient water absorption
3、Soft and will not damage the surface of the object.
4、Provide sufficient dry and wet strength.
5、Low ion release; 6、It is not easy to cause chemical reaction.
6、It is not easy to cause chemical reaction.
7、Optional sealing: ultrasonic, laser, cold cutting. Scope of application: semiconductor assembly, aviation manufacturing and maintenance, laboratories, electronics industry, computer assembly, optical instrument manufacturing, LCD liquid crystal display, precision instruments, optical products, aviation industry, and circuit board production lines, etc.; especially for the semiconductor industry, electronics industry production of 10-10,000 purification plant.
8、Using 18MΩ ultra-pure CDI cleaning, in the most advanced 100-class clean room packaging; four sides of the use of laser sealing, hair, fiber reduction, low dust fall, ion release is low
9、Excellent dust removal effect, with anti-static function; efficient water absorption, soft and will not damage the surface of the object; provide sufficient dry and wet strength.
10、Low ion release; not easy to cause chemical reaction. Optional sealing: ultrasonic, cold cutting.
11、Dust-free cloth the edges of the product is sealed by the most advanced edge cutting machine, wipe
It will not leave particles and threads, and has a strong ability to remove dirt.
12、Can use two sides of the fused edge sealing, the other two sides of the heat sealing method, or four sides of the fused edge sealing, can provide better protection of the edge.
13、Excellent dust removal effect, with anti-static function, efficient water absorption, soft will not damage the surface of the object.
Translated with www.DeepL.com/Translator (free version)
